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The 24th China International Optoelectronic Expo (CIOE) was grandly opened on 6th September 2023 at Shenzhen International Convention and Exhibition Centre (Bao'an New Venue). After two years, with the theme of "Green Optical Interconnection", Hitech brought 800G optical modules and silicon optical series products to the exhibition, bringing customised solutions for the optical communication industry.
In recent years, Hitech has been closely following the industry's technology trends and making forward-looking technical reserves around the future needs of customers. At this year's Optical Expo, Hitech focused on showcasing energy-saving and carbon-reducing data centre solutions to customers, focusing on solving the demand for AI computing power. It attracted many experts in the optical communication industry to stop and communicate with each other to explore the infinite possibilities of the optical communication industry in the future. At the CIOE, the launch of optical module products such as 800G OSFP DR8/SR8 and linear direct drive 400G Q112 SR4 LPO injected a shot in the arm for the growth of AI computing power demand. Hitech Semiconductor can vertically integrate the whole series of products from wafer to device to module, which can fully meet the diversified demands for high-performance and high-rate optical modules in the current market.
At the same time, Semiconductor Manufacturing Corporation (SMCC) also demonstrated a series of silicon optical products based on its mature wafer-in-module-out silicon optical platform. The new materials used are very competitive solutions for future high-speed optical interconnects. In high-speed scenarios, the cost advantage of silicon optical modules is more significant than traditional DML and EML.
Through fast wafer inspection, a unique chip packaging process, a highly reliable light source solution and multi-channel coupling design, Hitech adopts 2D and 3D hybrid COB packaging form based on compatibility with the existing industry chain, with high-speed performance and excellent heat dissipation performance, reaching the leading level of similar optical module products; the light source and the silicon optical chip are packaged in discrete packages, which are processed by the mature high-power laser hermetic packaging platform and COB production platform, and the quality of the products is high. The light source and silicon optical chip are discrete packages, which are processed by a mature high-power laser hermetic packaging platform and COB production platform respectively, and product quality is fully guaranteed.
During the same period of the exhibition, Dr. Sun Xu, Technical Director of Hitech, was invited to attend IFOC and delivered a keynote speech titled "Silicon Optical Technology, Enabling Green Data Centre". Dr Sun Xu said, "With the vigorous development of green data centres, how to slow down the increase of power consumption, cost including investment cost of optical modules while increasing the rate is the great challenge of the current development route of high-speed optical modules for the data centre. Silicon optical technology, as an extension technology of integrated circuits, is based on the mature and stable CMOS process platform as well as semiconductor sealing and testing platform, and uses the fabless industry chain model to empower green intelligent data centres to achieve the goal of carbon peak carbon neutrality."
After the speech, Dr Sun Xu participated in IFOC's roundtable forum on "Evolution of High-Speed Optical Interconnect under the Wave of AI". In response to the current growing demand for computing power, Haiku Semiconductor Manufacturing will make full use of its technological advantages and continue to optimise and upgrade its new products, empowering the fast-growing demand for AI computing power.
