The optoelectronic chip of Crealights' 1.6T OSFP 2xDR4 silicon photonics module employs a flip-chip packaging technology. It meets the high-speed data transmission requirements of 8x200G PAM4 over 500 meters at a case temperature range of 0-70°C. This module is primarily utilized in 1.6T Ethernet and data center applications.
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